Diamond fine grinding disc

1)Diamond pad is used for grinding and thinning of hard and brittle materials such as glass substrates (microcrystalline, ceramic, quartz, pen silicate, sapphire), semiconductor wafers (monocrystalline silicon, silicon carbide), precision ceramics (alumina, aluminum nitride, silicon nitride) through a uniquely designed cushion structure.
2)It is suitable for surface grinding of hard materials such as flat glass after diamond wire cutting. This allows a simple, clean and efficient grinding process.Can be used with water or cutting fluid.
3)They can be used on all conventional polishing and lapping machines.
4)Diamond grinding discs were developed as an alternative to conventional lapping processes to achieve the best results regarding the removal rates, surface quality and life time of the tools.