Cerium Oxide Slurry
Cerium Oxide Suspension
- Abrasive:Cerium compound
- Carrier liquid :Water-based
- PH value:3-13
- D50 :0.05μm-0.1μm;0.1μm-0.3μm;0.3μm-0.5μm
- Packing:500ML/BTL
Features
- 1 – Polishing slurries based on cerium compound abrasives have the advantages of fast silica removal speed and high planarization efficiency. In STI CMP, it is the best polishing material for SiO2 and Si3N4 materials.
- 2 – Products can be used for photomask polishing, TFT polishing and the most stringent surface polishing of general optical products (quartz glass, ceramic glass, BK7 and fused silica glass).
- 3 – Customized development is available upon request.
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